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NXP Releases Smallest, Toughest Power MOSFETs
Eindhoven, Netherlands and Manchester, UK, June 18, 2012 — NXP Semiconductors N.V. (NASDAQ: NXPI) today released its new LFPAK33 portfolio - a range of high switching performance MOSFETs available in an ultra-reliable 3.3-mm x 3.3-mm power package. Unlike many MOSFET packages of this size, LFPAK33 has been designed from the ground up to be a tough power solution. Incorporating copper clip and solder die attach technologies, it features a market-leading junction temperature of 175 degrees Celsius. Nine LFPAK33 power MOSFET types are available immediately.
As electronic devices become ever smaller, components need to shrink to fit the available space and MOSFETs are expected to work under extreme thermal and mechanical conditions. Continuously switching many tens of amps at high temperatures can cause solder joint failure or crack the package case, as the device expands at a different rate to the PCB. LFPAK33 minimizes the risk of this type of damage through its unique construction which allows the exposed SOURCE and GATE pins to "flex" and safely absorb thermally- and mechanically-induced stresses.
"The never-ending trend to miniaturization in power switching applications is driving the need for MOSFET packages that can reliably handle system power requirements while minimizing the PCB space required," said Dr. Dilder Chowdhury, product marketing manager, standard MOSFETs, NXP Semiconductors. "LFPAK33 builds on the success of NXP's LFPAK56 package, with comparable performance in an even smaller footprint. These packages have been designed for reliability, with best-in-class thermal performance. There's no other solution available that delivers this degree of robustness and power in such a small package."
LFPAK33 is fully compatible with QFN and DFN3333 packages - both in terms of PCB footprint and automated vision inspection. The PCB footprint has been fully tested for compatibility by Norcott Technologies.
Unique rugged construction, specifically designed for space-constrained power applications
No wire bonds, best-in-class thermal performance, up to 175°C
Uniquely resilient to mechanical and thermal stresses
Exposed leads means improved optical inspection of solder joints
Low 0.85-mm package height
Footprint compatible with QFN3333 / DFN3333
Proven track record from LFPAK56 - "The Toughest Power SO-8"
NextPower SuperJunction MOSFET technology
NXP LFPAK33 power MOSFET portfolio: http://www.nxp.com/lfpak33
PSMN2R8-25MLC - 25V 2.8 mΩ logic level MOSFET in LFPAK33
PSMN2R9-30MLC - 30V 2.95 mΩ logic level MOSFET in LFPAK33
PSMN3R0-30MLC - 30V 3.15 mΩ logic level MOSFET in LFPAK33
PSMN3R9-25MLC - 25V 4.15 mΩ logic level MOSFET in LFPAK33
PSMN4R4-30MLC - 30V 4.65 mΩ logic level MOSFET in LFPAK33
PSMN7R0-30MLC - 30V 7 mΩ logic level MOSFET in LFPAK33
PSMN9R0-25MLC - 25V 8.65 mΩ logic level MOSFET in LFPAK33
PSMN9R8-30MLC - 30V 9.8 mΩ logic level MOSFET in LFPAK33
PSMN013-30MLC - 30V 13.6 mΩ logic level MOSFET in LFPAK33
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