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Summary TI DualCool™ NexFET™ Power MOSFET Technology 
Category MOSFETs 
Subcategory DC/DC 
Power
Supply
Components
Enables top-side cooling
80% higher power dissipation
50% more current in standard footprint

TI's DualCool™ NexFET™ family of power MOSFETs delivers an industry standard footprint, while enabling thermally efficient cooling through the top and bottom of the package. This package allows power system designers to effectively direct heat away from the PCB in high-current DC/DC applications, resulting in improved power density, higher current capability and improved system reliability.

90% power supply efficiency, double the frequency
NexFET power MOSFET technology delivers half the gate charge for the same resistance so that designers can achieve 90% power-supply efficiencies with double the frequency.

NexFET power MOSFET technology improves energy efficiency in high-power computing, networking, server systems and power supplies.
 
Webpage More info 
Author SMPS Editor 
Date 1/13/2010 
 
 

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